男，工学博士，高级工程师，硕士生导师，中共党员，专注于先进电子封装领域聚合物基薄膜材料的研究与开发，通过高分子聚合物分子结构设计和无机填料表面改性，实现材料电学、热学和力学性能的综合调控，适配芯片封装加工工艺，确保长期稳定的服役性能；作为技术负责人，成功开发硅麦应用的埋入式电容材料和倒装芯片封装基板用积层胶膜材料，并实现商业化应用。 发表高水平学术论文65篇，包括《Energy & Environmental Science》（一作，IF 32.4）和《Advanced Energy Materials》（一作，IF 24.4）等高影响力SCI论文31篇，EI论文34篇，参与编写专著2部；申请发明专利70余项，授权22项，转化10项。

电介质复合材料

1. Suibin Luo, Junyi Yu, Shuhui Yu, et al., Significantly Enhanced Electrostatic Energy Storage Performance of Flexible Polymer Composites by Introducing Highly Insulating-Ferroelectric Microhybrids as Fillers, Advanced Energy Materials, 2019, vol. 9, 5, 1803204.

2. Suibin Luo, Talha Qasim Ansari, Junyi Yu, et al., Enhancement of dielectric breakdown strength and energy storage of all-polymer films by surface flattening, Chemical Engineering Journal, 2021, 412, 128476.

3. Junyi Yu, Lin Wang, Suibin Luo*, et al., Elaborately designed polymer dielectric films with low Coefficient of Thermal Expansion demonstrating high and stable electrostatic energy density over a wide temperature range, Materials Today Energy, 2022, vol.30, 101177.

4. Zhen’an Dou, Peng Li, Suibin Luo* et al., Epoxy Composite Films Filled with Sintered Multifaceted Boron Nitride for Thermal and Dielectric Applications, Ceramic International, 2024, vol.50, 23, 49293~49299.

5. Feng Zhang, Peng Li, Suibin Luo* et al., Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging, European Polymer Journal, 2024, vol.220, 113404.

发表高水平学术论文65篇，参与编写专著2部，申请发明专利70余项，授权22项，成功转化10项。