中国科学院深圳先进技术研究院研究员、博士生导师，中国科学院百人计划海外引进学者。长期从事与性能相关的材料结构及功能的显微组织表征和原位制备研究，重点为金属互连材料和封装结构的制备合成、组织性能及服役可靠性。

金属电子封装材料

1）Y. Gao, J.T. Jiu*, C.T. Chen, K. Suganuma, R. Sun, Z.Q. Liu*, Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test, J. Mater. Sci. Technol., 2022, 115:251-255.

2）X. Lu, L. Zhang*, Z.Q. Liu*, L.Y. Gao, C. Chen, C.J. Wu, X. Huang, K. Deng, Significant inhibition of interfacial Cu6Sn5 IMC and improvement of solder joint strength and reliability by applying (111) nanotwinned Cu substrate and vacuum soldering, Mater. Charact., 2024, 208:113668-11pages.

3）M.H. Zhang, L.Y. Gao, Y.X. Wang, W. Dong, N. Zhao*, Z.Q. Liu*, Micro-cones Cu fabricated by pulse electrodeposition for solderless Cu-Cu direct bonding, Appl. Surf. Sci., 2024, 650:159184-9pages.

4）K.X. Chen, L.Y. Gao*, Z.C. Meng, Z.Q. Liu*, Modulation of the twinning density and direction of copper nanowires and its effect on the oxidation mechanism, Chem. Eng. J., 2024, 496:154308-12pages.

5）W.J. Li, Z. Li*, F.Y. Zeng, Q. Zhang, L.W. Guo, D. Li, Y.H. Ma, Z.Q. Liu*, Cu pillar electroplating using a synthetic polyquaterntum leveler and its coupling effect on SAC305/Cu solder joint voiding, Materials, 2024, 17(22):5405-16pages.

发表Nature，Science等学术论文200余篇，被引6000余次；申请国内外发明专利80余件，已获授权中、日、美发明专利42件；与国际同行合作开发的三维透射电镜表征技术(3D-OMiTEM)荣获2012年度美国显微学会创新奖。