中国复合材料学会导热复合材料专业委员会副秘书长、中国科学院青促会优秀会员、深圳市“孔雀计划”海外高层次人才，入选斯坦福大学发布的2023年“全球前2%科学家榜单”

芯片散热与热界面材料

[1] Y. Wei, Y. Pang, X. Zeng, C. Zeng, L. Ren, J. Xu, R. Sun, X. Zeng. Thermally Conductive Yield-Stress Fluids with Reversible Solid-Liquid Transition Used as Thermal Interface Materials for Heat Dissipation of Chips[J]. ADVANCED FUNCTIONAL MATERIALS, 2024.

[2] W. Wu, J. Fan, C. Zeng, X. Cheng, X. Liu, S. Guo, R. Sun, L. Ren, Z. Hao, X. Zeng. Soft, Tough, Antifatigue Fracture Elastomer Composites with Low Thermal Resistance through Synergistic Crack Pinning and Interfacial Slippage[J]. Advanced Materials, 2024, 36(40): 2403661.

[3] C. Zeng, X. Zeng, X. Cheng, Y. Pang, J. Xu, R. Sun, X. Zeng. Design of Thermal Interface Materials with Excellent Interfacial Heat/Force Transfer Ability via Hierarchical Energy Dissipation[J]. Advanced Functional Materials, 2024, 34(41): 2406075.

[4] C. Wong, S. Wang, L. Ren, J.-B. Xu, X. Zeng, R. Sun. Thermally Conductive and Stretchable Elastomers Engineered via Ordered Hydrogen Bonding Interactions[J]. Advanced Functional Materials, 2024, 34(30): 2401157.

[5] X. Zeng, T. Liang, X. Cheng, J. Fan, Y. Pang, J. Xu, R. Sun, X. Xia, X. Zeng. Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction[J]. Nano Letters, 2024, 24(21): 6386-6394.

Google学术总引用次数超

一万次，h指数54，担任国际学术期刊《Advanced Devices & Instrumentation》的客座主编，以第一作者或通讯作者在Adv. Mater., Nano Letter, Adv. Funct. Mater., ACS Nano, IEEE Trans., Chip等期刊发表SCI论文100多篇，合著书籍《聚合物基导热复合材料》，授权专利36件